Realize an effective framework

With a combination of 3D-SJI and inspection before and after a process, quality control during the PCB production process and efforts in process improvement with the post-reflow quality as the starting point are possible.

The yield rate and actual defect rate can be confirmed in real time to swiftly address quality issues. In addition, control/analyze quality can be controlled using the quality control system.

SPC (Quality/production control screen)

This menu is mainly used by the administrator. This system can check the production quality by factory, line, and model. The pass rate, real defect rate, etc. for the designated period can be confirmed in real time.

Real defect Pareto analysis/False alarm Pareto analysis

This menu is mainly used by engineers. The priority sequence of improvements can be fixed through "abc" analysis of real defects and false alarms.

Production variation analysis (color map)

This menu is also used by engineers.The tendency where production and inspection abnormalities occur can be immediately grasped because the stability of production and inspection can be visually grasped.

Process collation

An engineer who has checked the status in the color map uses the process collation menu to complete the identification of the failure cause by confirming images by printing, mounting, and reflow process.

In this way, by using Q-up Navi, the cause of real fault or false alarm can be definitely identified, the analysis time can be shortened, and the PDCA cycle for improvements can be effectively implemented. In addition, the effect of implemented actions can be checked again by SPC. Furthermore, data can be used according to the existing formats such as reports because the data can be output to the CSV file.

Discover a powerful solution for solder joint inspection.

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