VT-M121 Dimensional and Visual Inspection
Fitted with Omron’s advanced motion and vision technology to provide repeatable measurements on a variety of applications.
You are currently viewing the Power Module Pin Inspection page.
Les solutions d’automatisation d’Omron permettent aux fabricants de VE de mettre en œuvre des protocoles d’inspection précis à un moment précis pendant la production, offrant des résultats d’inspection supérieurs et améliorant la qualité globale des produits. Omron vous permet de mesurer le positionnement des broches et des trous pendant l’assemblage du module d’alimentation, ce qui augmente la vitesse de production en même temps que le rendement.
For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.
Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.