PCB quality control systems must comply with the global quality standard ISO/TS 16949 at the mother factory as well as at any satellite factories. To help manufacturers deal more effectively with the competing demands of their trade, we’ve developed an innovative approach to ensuring solder joint quality that we call “3D-SJI.”
What is 3D-SJI?
3D-SJI takes a quantitative approach to assessing the shape of the solder joint. It helps manufacturers cost-effectively meet standards and market requirements by providing reliable, accurate information without depending on the specialized knowledge of the person overseeing the inspection process.
To accurately analyze the solder shape without relying on specialized knowledge, Omron’s technology references a combination of principles – such as abnormal lead heights and other unusual characteristics – that can indicate solder bond defects. Since it’s not affected by variations in color or component layout, 3D-SJI is very robust.
By combining 3D-SJI with before-and-after inspection, PCB quality control supports consistent process improvement with post-reflow quality. The yield rate and actual defect rate can be confirmed in real time to swiftly address quality issues.
What technologies support 3D-SJI?
Omron’s unique methodology uses a patented hybrid approach of several technologies to facilitate solder joint inspection and promote excellent connection reliability. These include the following:
- Color Highlight™ 3D shape reconstruction. Part of the VT-S530 and VT-S730 post-reflow AOI systems, this technology uses an optimal principle to promote stable inspection of a solder joint’s reflective surface.
- Fringe lighting system. Also known as oblique light irradiation, this technology uses the pattern Moiré principle and yields additional 3D data to expand the capturable range of a curved fillet and profile each solder joint.