For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.


Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.

Inspección de rayos X rápida

Inspeccione varias capas de condiciones y espesor de pasta de soldadura mediante una inspección de TC 3D completa.

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