VT-X750 3D CT X-RAY
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition, high-quality inspection using full 3D-CT.
Amélioration de l’inspection de la fixation de la carte de circuits imprimés à l’onduleur d’alimentation
La technologie d’inspection novatrice d’Omron reconnaît que le module d’alimentation est une partie essentielle du sous-assemblage de VE et permet une précision et une vitesse lors du mesurage de chaque zone de soudure pendant la fixation de la carte de circuit imprimé. Notre solution améliore les résultats d’inspection tout en optimisant la qualité des produits.
Challenge
For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.
Solution
Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.
