With the ability to perform pre or post reflow inspection, handle large format samples, and optional dual-lane configuration, the VT-S530 handles any production environment.  Built-in 3D and 2D inspection technologies measure ensure every solder joint while adhering to industrial IPC Standards.  Additionally, Omron’s completely offline programming and review software guarantee the least amount of process interruption.

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  • Omron, patented, Enchanced-3D solder joint profiling
  • AI-assisted, image processing
  • MDMC Color-Highlight illumination™ (multi-direction / multi-channel)
  • Quad, digital-MPS 3D hardware (multi-phase shift) 4-camera, angle-view inspection capabilities
  • Quantitative and comprehensive, real-3D measurement based inspection
  • IPC-compliant inspection approach
  • User-friendly, reliable operation and performance
  • Fast and easy, full offline programming approach
  • Intuitive, visual-based inspection review process
  • Integrated quality analysis software (Omron Q-up Navi) for true process improvement
  • Backed by Omron’s world class training, service and support