VT-X750 3D CT X-RAY
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition, high-quality inspection using full 3D-CT.
Mejora de la inspección de la conexión de PCB al inversor de potencia
La innovadora tecnología de inspección de Omron reconoce que el módulo de potencia es una parte fundamental del subconjunto de VE y permite la precisión y la velocidad cuando se mide cada área de soldadura durante la conexión del PCB. Nuestra solución mejora los resultados de la inspección y, al mismo tiempo, optimiza la calidad del producto.
Challenge
For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.
Solution
Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.
