3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Omron's proven inspection systems and enhanced software tools help manufacturers move closer to zero-defect production. With in-line, high-throughput and x-ray based solutions, Omron’s inspection machines can tackle a variety of PCB applications.
Omron provides a full range of SPI, AOI and AXI systems which are easy to use and offer fast inspection program generation. These solutions meet the complete inspection needs of any SMT manufacturer by helping identify the root cause of a failure while ensuring that escapes and false calls are eliminated.
Omron will showcase its latest AI-powered AOI technology, designed to enhance the SMT manufacturing process. This technology significantly reduces programming time and ensures detailed, accurate inspection of solder quality.
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
Omron’s numerous software solutions for quality control, process improvement, defect monitoring and more are ideal for PCB manufacturers seeking to boost productivity.
Omron’s 3D verification systems provide high-quality imagery to ensure the best results in post-solder inspection.
Combining Omron's advanced vision systems and motion control to provide fast, flexible and accurate inspection possibilities for post-SMT applications.
How do Omron’s innovations in AOI, AXI, and 3D SPI help you not simply identify defects, but actually prevent them from occurring in the first place? Watch this video to get a closer look at our integrated, intelligent, and interactive solutions that help you improve print quality, balance capability with speed, and maintain confidence in the quality of your product going out the door.
Learn more about these automated inspection topics
Why is AOI critical?
Automated Optical Inspection (AOI) is a fast and effective way to measure and classify every solder joint in a PCB assembly line.
Through rule-based inspection criteria, Omron’s AOI machines automatically analyze each solder joint and measure their characteristics against IPC standards. Additionally, every measurement is saved and tracked with Omron’s process control software which helps users spot potential production trends and eliminate defects.
Why do I need SPI?
While AOI is capable of pinpointing defects that occur after components have been placed, Solder Paste Inspection (SPI) is the only means of ensuring that the paste is properly deposited.
SPI measures the amount and location of the solder at each pad and can report potential issues. The SPI machine is also able to act as a feedback loop and provide real-time adjustment data back to the printer to perform subtle stencil alignments automatically.
Simply put, SPI has the ability to reduce the most amount of potential scrap by spotting potential solder issues before they ever happen.
The advantages of CT X-ray
A 3D CT X-Ray system captures a complete volumetric image of every solder joint allowing for unparalleled inspection capability.
Unlike traditional 2D methods, this approach removes any interference from components above, below or nearby ensuring hundreds of high-quality cross-section images.
The Omron CT X-Ray inspection system also measures each solder joint automatically, providing a systematic approach with extremely repeatable results.
How Omron stands out
Omron has over 30 years of experience as it was the first company to introduce the color-highlighting method to the automated I\inspection Industry.
The latest generation of Omron machines utilizes multiple inspection techniques producing results of the highest quality. Omron’s inspection solutions also offer completely offline programming, allowing for minimal production downtime as new programs are created.
Each machine is also connected to the same intelligent process control system which, operators and engineers can use to monitor real-time production quality and prevent process deviations.
Worthington Assembly Inc. successfully integrated Omron’s 3D AOI and 3D SPI technologies, resulting in a significant reduction in post-reflow defects and faster delivery of high-quality products. The integration minimized training requirements, as employees only needed to learn how to load SPI programs after printing boards, with the machine handling the rest.
The use of 3D CT X-ray technology for BGA inspection provides a more comprehensive analysis of each solder ball, enhancing the detection and analysis of defects like voiding, non-wetting, and head-in-pillow. This advanced technique is crucial for accurate root-cause analyses, ensuring high-quality and reliable electronic assemblies.
For continuous imaging technology, highly accurate positioning control and high-speed image sensing are required. With this technology, the VT-X750 caused take time to improve by more than double in comparison with the conventional machine, enabled low-radiation inspection, and created the industry’s first in-line, full surface inspection system. Built upon a new platform, the Omron AXI (automated X-ray inspection) system makes inspection safer and more comprehensive while continuing to evolve with the times.
Advancements in technology continue to shape our way of living. More and more of the services and products that humans use each day are driven by printed surface boards (PCBS). Automobiles which were once largely powered by mechanical systems, now feature multiple electric motors, auto-assisted parking, lane departure, driving assistance, and sophisticated routines which charge hybrid batteries as brakes are applied. Like countless other devices, these applications require high quality PCBs to operate and any malfunction could seriously compromise the user’s safety.