VT-X750 3D CT X-RAY
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition, high-quality inspection using full 3D-CT.
Melhorar a inspeção de conexão de PCB com o inversor de energia
A inovadora tecnologia de inspeção da Omron reconhece que o módulo de alimentação é uma parte essencial do subconjunto de EV e permite precisão e velocidade ao medir cada área de solda durante a conexão de PCB. Nossa solução melhora os resultados da inspeção enquanto otimiza simultaneamente a qualidade do produto.
Challenge
For e-axle production, particularly inverter assembly, several layers of solder paste are required to increase conversion efficiency during the die bonding process. The area and thickness of these layers must be measured in order to achieve optimum product quality.
Solution
Automated inspection technology developed by Omron specifically for this task helps to improve results and bolster product quality. Omron's VT-X750 3D CT X-RAY is capable of inspecting each layer of solder paste in a way that preserves the integrity of the product while prioritizing the quality of the inspection.
